Taiwan has broken ground on a new advanced semiconductor packaging industrial park in the southern city of Kaohsiung, with TSMC set to establish facilities for technology validation and workforce training, Reuters reported on September 21.
Kaohsiung Deputy Mayor Lo Ta-sheng said TSMC plans two buildings at the Baipu Industrial Park: a technology validation laboratory and a talent training centre. The facilities are expected to begin operating in the fourth quarter of 2029.
Advanced packaging has become increasingly important for high-performance computing and artificial-intelligence chips because it enables multiple components to be integrated closely in a single system. TSMC’s packaging technologies are used for advanced chips designed by companies including Nvidia, AMD and Broadcom.
Taiwan President Lai Ching-te said the park would allow equipment and materials suppliers to conduct research, testing and validation closer to major manufacturing operations, potentially shortening the time needed to move new technologies toward mass production.
The Baipu Industrial Park will cover about 88.7 hectares, with roughly 53.6 hectares designated for industrial use. It is intended to complement TSMC’s nearby operations and strengthen the broader semiconductor ecosystem in southern Taiwan.
The project is a long-term infrastructure development rather than immediate new production capacity, with the first TSMC facilities currently expected to start operations in 2029.