Shares in BE Semiconductor Industries (Besi) fell about 3% on Friday after semiconductor research firm SemiAnalysis reported that bigger rival ASML may be developing a competing hybrid bonding product.
SemiAnalysis said its analysis of 27 ASML patent filings indicated that ASML was developing a hybrid bonding tool, starting with a die-to-wafer machine. Hybrid bonding is an advanced packaging technology used to create more powerful three-dimensional chips, and Besi is a leader in the field despite being a fraction of ASML's size.
ASML has not confirmed that it is developing such a tool, and a spokesperson declined to comment on the SemiAnalysis report while pointing to the company's launch of its first advanced packaging tool last year. Besi did not respond to requests for comment.
Besi shares were down about 3% at 158.50 euros in midday Amsterdam trading, while ASML shares were up 1.1% at 1,480 euros. Analysts said advanced packaging has become a key frontier for performance gains in chips used for artificial intelligence.